Ap-12 thermal pad Suitable for notebook solid state, CPU/GPU heat pipes, and various heating circuits, excellent heat dissipation performance, Liquid cooling thermal accessories, up to 14.8W thermal conductivity.
Ap-12 thermal pad Suitable for notebook solid state, CPU/GPU heat pipes, and various heating circuits, excellent heat dissipation performance, Liquid cooling thermal accessories, up to 14.8W thermal conductivity.
Exert certain pressure to make it with good with both surfaces. Excellent thermal conductivity: Made of thermal silica gel with heat conductivity of 6.0 W/Mk. Easy to install, you can select most suitable thickness and cut the required sizes.
Excellent thermal conductivity: Made of thermal silica gel with heat conductivity of 6.0 W/Mk. Easy to install, you can select most suitable thickness and cut the required sizes. Remove the old heat-conducting material, clean the surface.
