MINIMIZATION OF THERMAL RESISTANCE: The thinner the pad, the lower the thermal resistance. VERSATILE APPLICATIONS: Heat-conducting, vibration-damping, mouldable, electrically insulating – can be easily cut to size.
MINIMIZATION OF THERMAL RESISTANCE: The thinner the pad, the lower the thermal resistance. VERSATILE APPLICATIONS: Heat-conducting, vibration-damping, mouldable, electrically insulating – can be easily cut to size.
It is also an ideal solution for those who want to bridge unevenness for an even cooling surface. The TP-3 is softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances.
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